格隆汇9月6日|据天科合达官方消息称,公司2025年初即实现导电型SiC衬底累计百万片级的出货突破,另外在“上车”应用方面也不断取得突破进展,公司正成为推动Si基功率芯片升级为SiC功率芯片,实现主驱规模化替代的
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