格隆汇1月5日|据帝尔激光消息,近日,帝尔激光应用于玻璃基板半导体封装的面板级激光微孔设备出口订单顺利发货,标志着公司在推动TGV(Through-Glass Via,玻璃通孔)技术产业化方面又迈出关键一步。
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